Equipment

Characterization
• AFM, Nanosurf
• AFM, Nanosurf Flex
• AFM, Veeco
• DIC microscope
• Focussed Ion Beam (FIB) Dual Beam
• Nanosight
• Particle Size Analyzer
• Profilometer
• Reflectometer
• S(T)EM
• SECM
• SEM (Table Top)
• Stereomicroscope
• STM, Nanosurf
• Yellow Light Microscope

Thermal Processes
• Binder Vacuum Ovens
• Calcination (gold) Furnace
• Drying Ovens
• Microwave Oven
• Rapid Thermal Processing (RTP) Oven
Lithography
• Electron Beam Lithography (EBL)
• Chemical Stations
• Mask Aligner EVG Nanoimprinter
• Mask Aligner MA56
• Mask Aligner MJB3
• Ovens for Lithography Processes
• Spin coaters

Deposition
• Carbon Coater for SEM sample preparation
• Dip Coater
• E-Beam Evaporator
• PECVD
• Spin Coater
• Sputter Coater and Thermal Evaporator
• Sputter Coater for SEM sample preparation

Etching, dry and wet
• HF-fumehood
• Inductive Coupled Plasma (ICP-RIE)
• Plasma Cleaner
• Reactive Ion Etch (RIE)

Other
• Autoclaves
• Glove Boxes
• Heidolph rotary evaporators
• Laminar Air Flow Benches
• PDMS area
• Safety bench
• Sartorius Analytical Balances
• Sartorius Precision Balances
• Dicing Saw
• Scriber
• Surface Plasmon Resonance
• Ultracentrifuge
• Ultrasound Desintegrator
• UV Ozone Cleaner
• Wire Bonder
• WTW pH-meter