Part of book/report

• Aasmundtveit, Knut; Tekseth, Kim Robert Bjørk; Breiby, Dag Werner; Nguyen, Hoang-Vu. (2019) High-energy X-ray Tomography for 3D Void Characterization in Au–Sn Solid-Liquid Interdiffusion (SLID) Bonds. 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC).