2024

• Kristiansen, Helge; Nghiem, Giang Minh; Bazilchuk, Molly Strimbeck; Aasmundtveit, Knut Eilif. (2024) Understanding the Contact Resistance in an ACF Bonding. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Xia, Hexin; Nguyen, Hoang-Vu; Roy, Avisek; Øhlckers, Per; Aasmundtveit, Knut Eilif. (2024) Robustness of Large-Size Vacuum Sealed Packages for Microbolometer Array. IEEE Transactions on Components, Packaging, and Manufacturing Technology
  Academic article
• Huynh, Van Long; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu. (2024) Flip-chip interconnects based on single metal-coated polymer spheres. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Nguyen, Hoang-Vu; Aasmundtveit, Knut Eilif. (2024) Assembly of Ultra-thin MEMS Device on Driver Chip Using Anisotropic Conductive Film. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Do, Nu Bich Duyen; Imenes, Kristin; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu; Andreassen, Erik. (2024) Thermally conductive polymer composites With hexagonal boron nitride for medical device thermal management. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Kuziora, Stephane; Aasmundtveit, Knut Eilif. (2024) Solid–Liquid Diffusion Stresses Leading to Voiding. Metallurgical and Materials Transactions A
  Academic article
• Wernicke, T.; Rebhan, B.; Vuorinen, V.; Paulasto-Kröckel, M.; Dubey, V.; Diex, K.. (2024) Review—Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration. ECS Journal of Solid State Science and Technology
  Academic literature review
• Thampi, Gayathry; Nguyen, Hoang-Vu; Aasmundtveit, Knut Eilif. (2024) Die Shear Strength of Au-In-Bi SLID Bonds at Elevated Temperatures. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Hernandez Gonzalez, Lisette; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu. (2024) Cu–(Sn–Bi) SLID Bond Microstructure Under Different Temperatures. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Huynh, Van Long; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu. (2024) Enabling Low Pressure, Low Temperature, and Particle Control for Anisotropic Conductive Adhesives. Advanced Materials Technologies
  Academic article
• Huynh, Van Long; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu. (2024) Compliant Interconnects Based on Single Micrometer-sized Metal-Coated Polymer Spheres. ACS Applied Materials & Interfaces
  Academic article

2023

• Hernandez Gonzalez, Lisette; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu. (2023) Low-Temperature Cu–(Sn–Bi) Solid Liquid Interdiffusion Bonding – An Initial Study. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Wernicke, Tobias; Rebhan, Bernhard; Vuorinen, Vesa; Paulasto-Krockel, Mervi; Dubey, Vikas; Diex, Kevin. (2023) Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration. ECS Transactions
  Academic literature review
• Kuziora, Stephane; Nguyen, Hoang-Vu; Aasmundtveit, Knut Eilif. (2023) Ag–(In–Bi) solid-state bonding. Journal of materials science. Materials in electronics
  Academic article
• Do, Nu Bich Duyen; Imenes, Kristin; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu; Andreassen, Erik. (2023) Thermal Conductivity and Mechanical Properties of Polymer Composites with Hexagonal Boron Nitride—A Comparison of Three Processing Methods: Injection Moulding, Powder Bed Fusion and Casting. Polymers
  Academic article
• Roy, Avisek; Ta, Bao Quoc; Azadmehr, Mehdi; Aasmundtveit, Knut Eilif. (2023) Post-CMOS processing challenges and design developments of CMOS-MEMS microheaters for local CNT synthesis. Microsystems & Nanoengineering
  Academic article
• Roy, Avisek; Aasmundtveit, Knut Eilif. (2023) Carbon Nanotube Growth on the Polysilicon Layers of CMOS. IEEE International Conference on Nanotechnology
  Academic article

2022

• Xia, Hexin; Roy, Avisek; Nguyen, Hoang-Vu; Ramic, Zekija; Aasmundtveit, Knut; Øhlckers, Per. (2022) Failure analysis of fabrication process in hermetic wafer-level packaging for microbolometer focal plane arrays. Microelectronics and reliability
  Academic article
• Huynh, Van Long; Aasmundtveit, Knut Eilif; Nguyen, Hoang-Vu. (2022) Selective Deposition of Conductive Particles for Anisotropic Conductive Adhesive Interconnects. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Nguyen, Hoang-Vu; Kuziora, Stephane; Aasmundtveit, Knut Eilif. (2022) Au-(In-Bi) and Ag-(In-Bi) Metallic Bonding for Temperature Sensitive Materials. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Aasmundtveit, Knut Eilif; Wang, Changhai; Rencz, Márta; Paulasto-Krockel, Mervi; Imenes, Kristin; Desmulliez, Marc P.Y.. (2022) Joint International Master in Smart Systems Integrated Solutions. IEEE conference proceedings
  Chapter
• Kuziora, Stephane; Nguyen, Hoang-Vu; Aasmundtveit, Knut. (2022) Ag-(In-Bi) Solid–Liquid Interdiffusion Bonding. Journal of Electronic Materials
  Academic article
• Roy, Avisek; Nguyen, Hoang Vu; Xia, Hexin; Papatzacos, Phillip; Øhlckers, Per Alfred; Aasmundtveit, Knut Eilif. (2022) Vacuum Packaging of MEMS-based Infrared Detectors. IEEE conference proceedings
  Academic chapter/article/Conference paper

2021

• Do, Nu Bich Duyen; Andreassen, Erik; Edwardsen, Stephen; Lifjeld, Anders; Aasmundtveit, Knut; Nguyen, Hoang-Vu. (2021) Thermal management of an interventional medical device with double layer encapsulation. Experimental heat transfer
  Academic article
• Aasmundtveit, Knut Eilif; Wang, Changhai; Rencz, Márta; Paulasto-Krockel, Mervi; Imenes, Kristin; Desmulliez, Marc P.Y.. (2021) Joint International Master in Smart Systems Integrated Solutions. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Xia, Hexin; Akram, Muhammad Nadeem; Roy, Avisek; Bardalen, Eivind; Nguyen, Hoang Vu; Hoivik, Nils. (2021) Design of Silicon Cap for Hermetic Packaging of Microbolometer Focal Plane Arrays. IEEE Transactions on Components, Packaging, and Manufacturing Technology
  Academic article
• Xia, Hexin; Roy, Avisek; Bardalen, Eivind; Nguyen, Hoang-Vu; Aasmundtveit, Knut Eilif; Øhlckers, Per. (2021) Impact of Micromachining Process on Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonds. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Kuziora, Stephane; Nguyen, Hoang-Vu; Aasmundtveit, Knut Eilif. (2021) Ni–Sn SLID bonds for assembly at extremely high temperatures. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Papatzacos, Phillip; Tiwary, Nikhilendu; Hoivik, Nils; Nguyen, Hoang-Vu; Roy, Avisek; Aasmundtveit, Knut Eilif. (2021) Investigation of seal frame geometry on Sn squeeze-out in Cu-Sn SLID bonds. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Nguyen, Hoang-Vu; Hernandez Gonzalez, Lisette; Imenes, Kristin; Aasmundtveit, Knut Eilif. (2021) Enabling Low-Temperature Reworkability for Anisotropic Conductive Adhesives. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper

2020

• Aasmundtveit, Knut Eilif; Imenes, Kristin; Svasta, Paul M.. (2020) Welcome. 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC)
  Editorial
• Larsson, Andreas; Aasmundtveit, Knut. (2020) On the Microstructure of Off-Eutectic Au-Ge Joints: A High-Temperature Joint. Metallurgical and Materials Transactions A
  Academic article
• Nguyen, Hoang-Vu; Kristiansen, Helge; Imenes, Kristin; Aasmundtveit, Knut. (2020) Peel Adhesion and Reworkability of Anisotropic Conductive Adhesive for Flex-to-Flex Assembly in Medical Devices. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Kuziora, Stephane; Nguyen, Hoang-Vu; Bolstad, Per Kristian; Aasmundtveit, Knut. (2020) Bi Behaviour in Au–(In–Bi) SLID Bonding. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Bolstad, Per Kristian; Kuziora, Stephane; Nguyen, Hoang-Vu; Manh, Tung; Aasmundtveit, Knut; Hoff, Lars. (2020) Impact of High Pressures on Au-Sn Solid Liquid Interdiffusion (SLID) Bonds. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Roy, Avisek; Marchetti, Luca; Azadmehr, Mehdi; Häfliger, Philipp; Ta, Bao Quoc; Aasmundtveit, Knut. (2020) Characterization of Polysilicon Microstructures to Estimate Local Temperature on CMOS Chips. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Aasmundtveit, Knut; Roy, Avisek; Ta, Bao Quoc. (2020) Direct Integration of Carbon Nanotubes in CMOS, towards an Industrially Feasible Process: A Review. IEEE transactions on nanotechnology
  Academic article
• Aasmundtveit, Knut; Imenes, Kristin; Svasta, Paul M.. (2020) 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC). IEEE (Institute of Electrical and Electronics Engineers) IEEE (Institute of Electrical and Electronics Engineers)
  Academic anthology/Conference proceedings
• Xia, Hexin; Akram, Muhammad Nadeem; Bardalen, Eivind; Roy, Avisek; Aasmundtveit, Knut; Øhlckers, Per. (2020) Evaluation of Silicon Diaphragms for Hermetic Packaging of Microbolometer Arrays. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper

2019

• Aasmundtveit, Knut; Roy, Avisek; Ta, Bao Quoc. (2019) Carbon nanotubes directly integrated in CMOS by local synthesis-Towards a wafer-level process. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Aasmundtveit, Knut; Tekseth, Kim Robert Bjørk; Breiby, Dag Werner; Nguyen, Hoang-Vu. (2019) High-energy x-ray tomography for 3d void characterization in au-sn solid-liquid interdiffusion (SLID) bonds. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Aasmundtveit, Knut; Luu, Thi Thuy; Nguyen, Hoang-Vu; Larsson, Andreas; Tollefsen, Torleif Andre. (2019) Solid-liquid InterDiffusion (SLID) Bonding, for Thermally Challenging Applications. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Nguyen, Hoang-Vu; Kristiansen, Helge; Lifjeld, Anders; Imenes, Kristin; Aasmundtveit, Knut. (2019) Reworkable Anisotropic Conductive Adhesive for Assembly of Medical Devices. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Do, Nu Bich Duyen; Andreassen, Erik; Edwardsen, Stephen; Lifjeld, Anders; Nguyen, Hoang-Vu; Aasmundtveit, Knut. (2019) New encapsulation concepts for medical ultrasound probes- A heat transfer simulation study. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Roy, Avisek; Azadmehr, Mehdi; Häfliger, Philipp; Ta, Bao Quoc; Aasmundtveit, Knut Eilif. (2019) Direct Synthesis of Carbon Nanotubes in CMOS-Layout of Micro-heaters. IEEE International Conference on Nanotechnology
  Academic article
• Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut. (2019) A Review of Eutectic Au-Ge Solder Joints. Metallurgical and Materials Transactions A
  Academic literature review
• Roy, Avisek; Azadmehr, Mehdi; Ta, Bao Quoc; Häfliger, Philipp; Aasmundtveit, Knut. (2019) Design and fabrication of CMOS microstructures to locally synthesize carbon nanotubes for gas sensing. Sensors
  Academic article
• Larsson, Andreas; Tollefsen, Torleif Andre; Aasmundtveit, Knut. (2019) Shear strength of off-eutectic Au-Ge joints at high-temperature. Microelectronics and reliability
  Academic article

2018

• Aasmundtveit, Knut Eilif; Luu, Thi Thuy; Nguyen, Hoang-Vu; Larsson, Andreas; Tollefsen, Torleif Andre. (2018) Intermetallic Bonding for High-Temperature Microelectronics and Microsystems: Solid-Liquid Interdiffusion Bonding. IntechOpen
  Academic chapter/article/Conference paper
• Larsson, Andreas; Tollefsen, Torleif Andre; Aasmundtveit, Knut; Løvvik, Ole Martin. (2018) Liquid Solid Diffusion (LSD) bonding: A novel joining technology. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Holhjem, Lars; Strand-Amundsen, Runar James; Aasmundtveit, Knut Eilif; Tønnessen, Tor Inge. (2018) Stability of Laser-Patterned Electrode Compositions. IEEE Transactions on Components, Packaging, and Manufacturing Technology
  Academic article
• Nghiem, Giang Minh; Aasmundtveit, Knut Eilif; Kristiansen, Helge; Bazilchuk, Molly Strimbeck. (2018) Anisotropic Conductive Film (ACF) bonding: Effect of interfaces on contact resistance. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Aasmundtveit, Knut Eilif; Jiang, Hui; Tollefsen, Torleif Andre; Luu, Thi-Thuy; Nguyen, Hoang-Vu. (2018) Phase determination in SLID bonding. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Aasmundtveit, Knut Eilif; Eggen, Trym Haakon; Manh, Tung; Nguyen, Hoang-Vu. (2018) In-Bi low-temperature SLID bonding for piezoelectric materials. Soldering & surface mount technology
  Academic article
• Aasmundtveit, Knut Eilif; Wang, Changhai; Rencz, Márta; Desmulliez, Marc P.Y.; Ender, Ferenc; Imenes, Kristin. (2018) Joint International Master in Smart Systems Integration: University Collaboration for Improved Education. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Imenes, Kristin; Aasmundtveit, Knut Eilif. (2018) Educational Needs and Open Education Resources in Micro- and Nanotechnolog. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper

2017

• Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut Eilif. (2017) Thermoelectric module for high temperature application. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Roy, Avisek; Ender, Ferenc; Azadmehr, Mehdi; Ta, Bao Quoc; Aasmundtveit, Knut Eilif. (2017) Design considerations of CMOS micro-heaters to directly synthesize carbon nanotubes for gas sensing applications. IEEE International Conference on Nanotechnology
  Academic article
• Nguyen, Hoang-Vu; Do, Nu Bich Duyen; Aasmundtveit, Knut Eilif. (2017) Low-Temperature High-Throughput Assembly Technology for Transducer Array in Medical Imaging Applications. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Roy, Avisek; Ender, Ferenc; Azadmehr, Mehdi; Aasmundtveit, Knut Eilif. (2017) CMOS micro-heater design for direct integration of carbon nanotubes. Microelectronics and reliability
  Academic article
• Sandvand, Åsmund; Halvorsen, Einar; Aasmundtveit, Knut Eilif; Jakobsen, Henrik. (2017) Identification and Elimination of Hygro-Thermo-Mechanical Stress-Effects in a High-Precision MEMS Pressure Sensor. Journal of microelectromechanical systems
  Academic article

2016

• Gustavsen, Kim Robert; Nygård, Ken Alexander; Honerød-Bentsen, Preben; Du, Kang; Liu, Guohua; Tayyib, Muhammad. (2016) Wafer-level fabrication and characterization of amorphous thin films MoS2 prepared by RF magnetron sputtering technique. ECS Transactions
  Academic article
• Roy, Avisek; Ender, Ferenc; Azadmehr, Mehdi; Aasmundtveit, Knut Eilif. (2016) Optimal Thermal Design of CMOS for Direct Integration of Carbon Nanotubes. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Aasmundtveit, Knut Eilif; Luu, Thi Thuy; Tollefsen, Torleif Andre; Wang, Kaiying; Nguyen, Hoang-Vu; Hoivik, Nils. (2016) Solid-Liquid Interdiffusion (SLID) Bonding - Intermetallic Bonding for High Temperature Applications. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Nguyen, Hoang-Vu; Manh, Tung; Eggen, Trym; Aasmundtveit, Knut Eilif. (2016) Au-Sn Solid-Liquid Interdiffusion (SLID) bonding for mating surfaces with high roughness. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Nguyen Thai, Anh Tuan; Aasmundtveit, Knut Eilif; Hoff, Lars; Imenes, Kristin; Tyssø, Jonas; Grymyr, Ole-Johannes. (2016) Improved Design of an Implantable Heart Monitoring Device. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Larsson, Andreas; Tollefsen, Torleif Andre; Aasmundtveit, Knut Eilif. (2016) Ni-Sn solid liquid interdiffusion (SLID) bonding — Process, bond characteristics and strength. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Nghiem, Giang Minh; Nguyen, Huyen Thanh; Aasmundtveit, Knut Eilif; Kristiansen, Helge. (2016) Simulation of Adhesive Flow during ACF Bonding Process for Display Interconnect. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Aasmundtveit, Knut Eilif; Nguyen, Vy; Nguyen, Hoang-Vu. (2016) In-Bi low-temperature SLID bonding. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Nghiem, Giang Minh; Kristiansen, Helge; Aasmundtveit, Knut. (2016) Investigation of contacts between metal and transparent conductive oxides. IEEE (Institute of Electrical and Electronics Engineers)
  Academic chapter/article/Conference paper
• Manh, Tung; Nguyen, Hoang-Vu; Le, Ahn Duy; Aasmundtveit, Knut Eilif; Hoff, Lars; Eggen, Trym. (2016) Au-Sn Solid-Liquid Interdiffusion (SLID) bonding for piezoelectric ultrasonic transducers. Proceedings - IEEE Ultrasonics Symposium
  Academic article
• Nguyen, Hoang-Vu; He, Jianying; Helland, Tore; Kristiansen, Helge; Aasmundtveit, Knut Eilif. (2016) Electrical characterization of individual metal-coated polymer spheres used in isotropic conductive adhesives. Journal of Applied Polymer Science
  Academic article

2015

• Duan, Ani; Luu, Thi Thuy; Wang, Kaiying; Aasmundtveit, Knut Eilif; Hoivik, Nils. (2015) Wafer-level Cu-Sn micro-joints with high mechanical strength and low Sn overflow. Journal of Micromechanics and Microengineering (JMM)
  Academic article
• Tjulkins, Fjodors; Nguyen Thai, Anh Tuan; Andreassen, Erik; Aasmundtveit, Knut Eilif; Høivik, Nils Deneke; Hoff, Lars. (2015) Fabrication and assembly of MEMS accelerometer-based heart monitoring device with simplified, one step placement. Journal of Medical Engineering & Technology
  Academic article
• Sandvand, Åsmund; Halvorsen, Einar; Aasmundtveit, Knut Eilif; Jakobsen, Henrik. (2015) Influence of Glass-Frit Material Distribution on the Performance of Precision Piezoresistive MEMS Pressure Sensors. IEEE Transactions on Components, Packaging, and Manufacturing Technology
  Academic article
• Nguyen Thai, Anh Tuan; Tjulkins, Fjodors; Aasmundtveit, Knut Eilif; Hoivik, Nils; Hoff, Lars; Grymyr, Ole-Johannes. (2015) Development of a Multifunctional Implantable Heart Monitoring Device. Journal of Microelectronics and Electronic Packaging
  Academic article
• Larsson, Andreas; Tran, Thanh-Nam; Aasmundtveit, Knut Eilif; Seeberg, Trine Margrethe. (2015) Encapsulation for Smart Textile Electronics - Humidity and Temperature Sensor. IOS Press
  Academic chapter/article/Conference paper
• Luu, Thi Thuy; Høivik, Nils Deneke; Wang, Kaiying; Aasmundtveit, Knut Eilif; Vardøy, Astrid-Sofie Borge. (2015) High-temperature mechanical integrity of Cu-Sn SLID wafer-level bonds. Metallurgical and Materials Transactions A
  Academic article
• Luu, Thi Thuy; Høivik, Nils Deneke; Wang, Kaiying; Aasmundtveit, Knut Eilif; Vardøy, Astrid-Sofie Borge. (2015) Characterization of wafer-level au-in-bonded samples at elevated temperatures. Metallurgical and Materials Transactions A
  Academic article
• Aasmundtveit, Knut Eilif. (2015) Direct Integration of Carbon Nanotubes in Si Microsystems. Springer Publishing Company
  Academic chapter/article/Conference paper
• Nguyen, Hoang-Vu; Eggen, Trym; Aasmundtveit, Knut Eilif. (2015) Assembly of transducer array using anisotropic conductive film for medical imaging applications. International Microelectronics and Packaging Society (IMAPS)
  Academic chapter/article/Conference paper
• Aasmundtveit, Knut Eilif; Luu, Thi Thuy; Wang, Kaiying; Hoivik, Nils. (2015) Void formation in Cu-Sn Solid-Liquid Interdiffusion (SLID) bonding. International Microelectronics and Packaging Society (IMAPS)
  Academic chapter/article/Conference paper
• Sandvand, Åsmund; Halvorsen, Einar; Aasmundtveit, Knut Eilif; Jakobsen, Henrik. (2015) Influence of sensor-package hermeticity-level on long-term drift for a piezoresistive MEMS pressure-sensor. International Microelectronics and Packaging Society (IMAPS)
  Academic chapter/article/Conference paper
• Larsson, Andreas; Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut Eilif. (2015) Ni-Sn solid-liquid interdiffusion (SLID) bonding for thermo-electric elements in extreme environments - FEA of the joint stress. International Microelectronics and Packaging Society (IMAPS)
  Academic chapter/article/Conference paper

2014

• Vardøy, Astrid-Sofie Borge; van de Wiel, H. J.; Martinsen, Stian; Hayes, G.; Fischer, H.; Aasmundtveit, Knut E.. (2014) Void formation and bond strength investigated for wafer-level Cu-Sn Solid-Liquid Interdiffusion (SLID) bonding. Journal of Microelectronics and Electronic Packaging
  Academic article
• Nguyen Thai, Anh Tuan ; Tjulkins, Fjodors; Aasmundtveit, Knut Eilif; Hoivik, Nils; Hoff, Lars; Imenes, Kristin. (2014) Miniaturization of package for an implantable heart monitoring device. Microsystem Technologies : Micro- and Nanosystems Information Storage and Processing Systems
  Academic article
• Nguyen, Hoang-Vu; Eggen, Trym Haakon; Sten-Nilsen, Bjørnar; Imenes, Kristin; Aasmundtveit, Knut Eilif. (2014) Assembly of multiple chips on flexible substrate using anisotropie conductive film for medical imaging applications. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Tjulkins, Fjodors; Nguyen Thai, Anh Tuan; Andreassen, Erik; Hoivik, Nils; Aasmundtveit, Knut Eilif; Hoff, Lars. (2014) MEMS-based implantable heart monitoring system with integrated pacing function. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Nguyen Thai, Anh Tuan; Tjulkins, Fjodors; Aasmundtveit, Knut Eilif; Hoivik, Nils; Hoff, Lars; Grymyr, Ole-Johannes. (2014) Packaging of a Multifunctional Implantable Heart Monitoring Device. EDA Publishing Association
  Academic chapter/article/Conference paper
• Aasmundtveit, Knut Eilif; Luu, Thi Thuy; Vardøy, Astrid-Sofie Borge; Tollefsen, Torleif Andre; Wang, Kaiying; Hoivik, Nils. (2014) High-temperature shear strength of solid-liquid interdiffusion (SLID) bonding: Cu-Sn, Au-Sn and Au-In. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Aasmundtveit, Knut Eilif; Ta, Bao Quoc; Ngo, Anh Van; Nilsen, Ola; Hoivik, Nils. (2014) Functionalization of suspended carbon nanotubes in silicon microsystems by Atomic Layer Deposition (ALD). IEEE conference proceedings
  Academic chapter/article/Conference paper
• Sandvand, Åsmund; Halvorsen, Einar; Aasmundtveit, Knut Eilif. (2014) Finite element modelling of influence of bonding material distribution in precision piezoresistive MEMS pressure-sensors. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Cao, Vinh Duy; Nguyen, Hoang-Vu; Kristiansen, Helge; Taklo, Maaike Margrete Visser; Aasmundtveit, Knut Eilif; Hoivik, Nils. (2014) Immobilization of metal coated polymer spheres on Indium pads. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Holhjem, Lars; Strand-Amundsen, Runar; Aasmundtveit, Knut Eilif; Tønnessen, Tor Inge. (2014) Electrode compositions for laser patterned conductometric sensors. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Watson, David E.; Ng, Jack H-G; Aasmundtveit, Knut Eilif; Desmulliez, Marc P.Y.. (2014) In-situ silver nanoparticle formation on surface-modified polyetherimide films. IEEE transactions on nanotechnology
  Academic article
• Ta, Bao Quoc; Aasmundtveit, Knut E.. (2014) Local synthesis and direct integration of carbon nanotubes into microsystems for sensor applications. Doctoral theses at Buskerud and Vestfold University College (1)
  Doctoral dissertation
• Nguyen, Hoang Vu; Aasmundtveit, Knut E.; Kristiansen, Helge; Helland, Tore. (2014) An Overview of Isotropic Conductive Adhesives Filled with Metal-coated Polymer Spheres. Curran Associates, Inc.
  Academic chapter/article/Conference paper
• Nguyen, Hoang-Vu; Eggen, Trym Haakon; Sten-Nilsen, Bjørnar; Imenes, Kristin; Aasmundtveit, Knut Eilif. (2014) Assembly of multiple chips on flexible substrate using anisotropie conductive film for medical imaging applications. Electronic Components and Technology Conference (ECTC)
  Academic article

2013

• Tollefsen, Torleif Andre; Løvvik, Ole Martin; Aasmundtveit, Knut E.; Larsson, Andreas. (2013) Effect of Temperature on the Die Shear Strength of a Au-Sn SLID Bond. Metallurgical and Materials Transactions A
  Academic article
• Aasmundtveit, Knut E.; Tollefsen, Torleif Andre; Luu, Thi Thuy; Duan, Ani; Wang, Kaiying; Hoivik, Nils. (2013) Solid-Liquid Interdiffusion (SLID) bonding — Intermetallic bonding for high temperature applications. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Aasmundtveit, Knut E.; Ta, Bao Quoc; Nguyen, Quoc-Huy; Haugen, Tormod Bjørnetun; Hoivik, Nils; Halvorsen, Einar. (2013) Direct integration of Carbon Nanotubes in Si microsystems — Towards truly integrated micro/nano systems. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Luu, Thi Thuy; Duan, Ani; Wang, Kaiying; Aasmundtveit, Knut E.; Hoivik, Nils. (2013) Cu/Sn SLID wafer-level bonding optimization. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Tjulkins, Fjodors; Nguyen Thai, Anh Tuan ; Hoivik, Nils; Aasmundtveit, Knut E.; Andreassen, Erik; Hoff, Lars. (2013) 3-Axis MEMS accelerometer-based implantable heart monitoring system with novel fixation method. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Ta, Bao Quoc; Halvorsen, Einar; Hoivik, Nils; Aasmundtveit, Knut E.. (2013) Diameter dependency for the electric-field-assisted growth of carbon nanotubes. Applied Physics Letters
  Academic article
• Aasmundtveit, Knut E.; Ta, Bao Quoc; Nguyen, Quoc-Huy; Haugen, Tormod Bjørnetun; Hoivik, Nils; Halvorsen, Einar. (2013) Local synthesis of carbon nanotubes for direct integration in Si microsystems – design considerations. Advances in Manufacturing
  Academic article
• Haugen, Tormod Bjørnetun; Ta, Bao Quoc; Halvorsen, Einar; Hoivik, Nils; Aasmundtveit, Knut E.. (2013) Integration of Carbon Nanotubes in Microsystems: Local Growth and Electrical Properties of Contacts. Materials
  Academic article
• Nguyen, Quoc-Huy; Ta, Bao Quoc; Hoivik, Nils; Halvorsen, Einar; Aasmundtveit, Knut E.. (2013) Carbon Nanotube Based Gas Sensor for Expiration Detection of Perishable Food. IEEE International Conference on Nanotechnology
  Academic article
• Ta, Bao Quoc; Ngo, Anh Van; Nguyen, Quoc-Huy; Hoivik, Nils; Halvorsen, Einar; Aasmundtveit, Knut E.. (2013) Deposition of Palladium on suspended and locally grown Carbon nanotubes using thermal evaporation. IEEE International Conference on Nanotechnology
  Academic article
• Ta, Bao Quoc; Haugen, Tormod Bjørnetun; Hoivik, Nils; Halvorsen, Einar; Aasmundtveit, Knut E.. (2013) Local Synthesis of Carbon Nanotubes in Silicon Microsystems: The Effect of Temperature Distribution on Growth Structure. Materials
  Academic article
• Luu, Thi Thuy; Duan, Ani; Aasmundtveit, Knut E.; Hoivik, Nils. (2013) Optimized Cu-Sn wafer-level bonding using intermetallic phase characterization. Journal of Electronic Materials
  Academic article
• Nguyen Thai, Anh Tuan ; Tjulkins, Fjodors; Aasmundtveit, Knut E.; Hoivik, Nils; Hoff, Lars; Imenes, Kristin. (2013) Miniaturization of package for an implantable heart monitoring device. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Tollefsen, Torleif Andre; Larsson, Andreas; Løvvik, Ole Martin; Aasmundtveit, Knut E.. (2013) High Temperature Interconnect and Die Attach Technology: Au–Sn SLID Bonding. IEEE Transactions on Components, Packaging, and Manufacturing Technology
  Academic article
• Nguyen, Hoang Vu; Andreassen, Erik; Kristiansen, Helge; Aasmundtveit, Knut E.. (2013) Die Shear Testing of a Novel Isotropic Conductive Adhesive-Epoxy Filled With Metal-Coated Polymer Spheres. IEEE Transactions on Components, Packaging, and Manufacturing Technology
  Academic article
• Nguyen, Hoang Vu; Andreassen, Erik; Kristiansen, Helge; Johannessen, Rolf; Hoivik, Nils; Aasmundtveit, Knut E.. (2013) Rheological characterization of a novel isotropic conductive adhesive - Epoxy filled with metal-coated polymer spheres. Materials & Design
  Academic article
• Imenes, Kristin; Nguyen, Hoang Vu; Lifjeld, Anders; Eggen, T.; Baumgartner, Charles E.; Aasmundtveit, Knut E.. (2013) Flex to flex bonding using anisotropic conductive film for imaging systems. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Holhjem, Lars; Strand-Amundsen, Runar; Aasmundtveit, Knut E.; Tønnessen, Tor Inge. (2013) Development of a conductometric biocompatible sensor for detecting ischemia. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Tollefsen, Torleif Andre; Larsson, Andreas; Taklo, Maaike Margrete Visser; Neels, Antonia; Maeder, Xavier; Høydalsvik, Kristin. (2013) Au-Sn SLID bonding: A reliable HT interconnect and die attach technology. Metallurgical and Materials Transactions B
  Academic article
• Aasmundtveit, Knut E.; Ta, Bao Quoc; Hoivik, Nils; Halvorsen, Einar. (2013) Electrical control of synthesis conditions for locally grown CNTs on a polysilicon microstructure. CRC Press
  Academic chapter/article/Conference paper

2012

• Tollefsen, Torleif Andre; Larsson, Andreas; Løvvik, Ole Martin; Aasmundtveit, Knut E.. (2012) Au-Sn SLID bonding - properties and possibilities. Metallurgical and Materials Transactions B
  Academic article
• Aasmundtveit, Knut E.; Ta, Bao Quoc; Lin, Liwei; Halvorsen, Einar; Hoivik, Nils. (2012) Direct integration of carbon nanotubes in Si microstructures. Journal of Micromechanics and Microengineering (JMM)
  Academic article
• Hoivik, Nils; Aasmundtveit, Knut E.. (2012) Wafer-level solid-liquid interdiffusion bonding. Wiley-VCH
  Academic chapter/article/Conference paper
• Nguyen, Hoang Vu; Kristiansen, Helge; Johannessen, Rolf; Andreassen, Erik; Hoivik, Nils; Aasmundtveit, Knut E.. (2012) Isotropic conductive adhesive filled with metal-coated polymer spheres – Effects of metal coating on rheological and mechanical properties. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Luu, Thi Thuy; Duan, Ani; Wang, Kaiying; Aasmundtveit, Knut E.; Hoivik, Nils. (2012) Optimization of Cu/Sn wafer-level bonding based upon intermetallic characterization. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Ng, Jack Hoy-Gig; Ssekitoleko, Robert T.; Nguyen, Hoang Vu; Aasmundtveit, Knut E.; Démoré, Christine E.M.; Cochran, Sandy. (2012) Low temperature bonding of piezoelectric single crystal materials for miniaturized high resolution ultrasound transducers. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Nguyen, Hoang Vu; Kristiansen, Helge; Larsson, Andreas; Poppe, Erik; Johannessen, Rolf; Hoivik, Nils. (2012) Anisotropic conductive film interconnects for fine-pitch MEMS. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Aasmundtveit, Knut E.; Luu, Thi Thuy; Eggen, Trym; Baumgartner, Charles E.; Hoivik, Nils; Wang, Kaiying. (2012) Thermosonic bonding for ultrasound transducers: Low-temperature metallurgical bonding. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Duan, Ani; Wang, Kaiying; Aasmundtveit, Knut E.; Hoivik, Nils. (2012) Reducing the bond frame width in Cu/Sn SLID wafer level packaging. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Imenes, Kristin; Andersen, Mona Helene; Nguyen, Anh Tuan Thai; Tjulkins, Fjodors; Aasmundtveit, Knut E.; Hoivik, Nils. (2012) Implantable MEMS acceleration sensor for heart monitoring : recent development and outlook. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Ta, Bao Quoc; Nguyen, Quoc-Huy; Hoivik, Nils; Halvorsen, Einar; Aasmundtveit, Knut E.. (2012) Observations on defects and contact modes for locally grown CNTs. IEEE International Conference on Nanotechnology
  Academic article
• Tollefsen, Torleif Andre; Taklo, Maaike Margrete Visser; Aasmundtveit, Knut E.; Larsson, Andreas. (2012) Reliable HT electronic packaging – Optimization of a Au-Sn SLID joint. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Liu, He; Wang, Kaiying; Aasmundtveit, Knut E.; Hoivik, Nils. (2012) Intermetallic Compound Formation Mechanisms for Cu-Sn Solid-Liquid Interdiffusion Bonding. Journal of Electronic Materials
  Academic article

2011

• Nguyen, Hoang Vu; Kristiansen, Helge; Johannessen, Rolf; Andreassen, Erik; Hoivik, Nils; Aasmundtveit, Knut E.. (2011) Temperature dependence of mechanical properties of isotropic conductive adhesive filled with metal coated polymer spheres. Electronic Components and Technology Conference (ECTC)
  Academic article
• Ha, Cu Nguyen Phuong; Nguyen, Hoang Vu; Hoivik, Nils; Aasmundtveit, Knut E.. (2011) Ultrasonic assisted room temperature Sn-Sn and Cu-Cu bonding. Universitetet i Sørøst-Norge/Universitetet i Søraust-Noreg
  Academic chapter/article/Conference paper
• Hoivik, Nils; Aasmundtveit, Knut E.; Wang, Kaiying. (2011) Slid bonding for wafer-level. Universitetet i Sørøst-Norge/Universitetet i Søraust-Noreg
  Academic chapter/article/Conference paper
• Aasmundtveit, Knut E.; Ta, Bao Quoc; Hoivik, Nils; Halvorsen, Einar. (2011) Direct integration of carbon nanotubes in Si microstrutures. Universitetet i Sørøst-Norge/Universitetet i Søraust-Noreg
  Academic chapter/article/Conference paper
• Tran, Thanh-Nam; Larsson, Andreas; Andreassen, Erik; Aasmundtveit, Knut E.; Seeberg, Trine Margrethe. (2011) Smart textiles - encapsulation of sensors. Universitetet i Sørøst-Norge/Universitetet i Søraust-Noreg
  Academic chapter/article/Conference paper
• Duan, Ani; Wang, Kaiying; Aasmundtveit, Knut E.; Hoivik, Nils. (2011) Characterization of metallic wafer level bonding for hermetic applications. Universitetet i Sørøst-Norge/Universitetet i Søraust-Noreg
  Academic chapter/article/Conference paper
• Ta, Bao Quoc; Hoivik, Nils; Halvorsen, Einar; Aasmundtveit, Knut E.. (2011) Electrical control of synthesis conditions for locally grown CNTs on polysilicon microstructure. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Tollefsen, Torleif Andre; Larsson, Andreas; Aasmundtveit, Knut E.. (2011) Au-Sn SLID bonding for high temperature applications. International Microelectronics and Packaging Society (IMAPS)
  Academic chapter/article/Conference paper
• Liu, He; Salomonsen, Guttorm; Wang, Kaiying; Aasmundtveit, Knut E.; Høivik, Nils. (2011) Wafer-level Cu/Sn to Cu/Sn SLID-bonded interconnects with increased strength. IEEE Transactions on Components, Packaging, and Manufacturing Technology
  Academic article
• Duan, Ani; Aasmundtveit, Knut E.; Hoivik, Nils. (2011) Ultra-low leak detection of Cu-Sn SLID for high density wafer level packaging. IEEE Press
  Academic chapter/article/Conference paper

2010

• Liu, He; Wang, Kaiying; Aasmundtveit, Knut E.; Høivik, Nils. (2010) Intermetallic Cu3Sn as Oxidation Barrier for Fluxless Cu-Sn Bonding. Electronic Components and Technology Conference (ECTC)
  Academic article
• Liu, He; Wang, Kaiying; Aasmundtveit, Knut E.; Høivik, Nils. (2010) Intermetallic Cu3Sn as oxidation barrier for fluxless Cu-Sn bonding. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Høivik, Nils; Wang, Kaiying; Aasmundtveit, Knut E.; Salomonsen, Guttorm; Lapadatu, Adriana; Kittilsland, Gjermund. (2010) Fluxless wafer-level Cu-Sn bonding for micro- and nanosystems packaging. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Nguyen, Hoang Vu; Kristiansen, Helge; Gakkestad, Jakob; Johannessen, Rolf; Høivik, Nils; Aasmundtveit, Knut E.. (2010) Spherical polymer particles in isotropic conductive adhesives : a study on rheology and mechanical aspects. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Høivik, Nils; Liu, He; Wang, Kaiying; Salomonsen, Guttorm; Aasmundtveit, Knut E.. (2010) High-temperature stable Au-Sn and Cu-Sn interconnects for 3D stacked applications : advanced processes and materials. Springer Science+Business Media B.V.
  Academic chapter/article/Conference paper
• Aasmundtveit, Knut E.; Luu, Thi Thuy; Nguyen, Hoang Vu; Johannessen, Rolf; Høivik, Nils; Wang, Kaiying. (2010) Au-Sn fluxless SLID bonding: Effect of bonding temperature for stability at high temperature, above 400 °C. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Luu, Thi Thuy; Nguyen, Hoang-Vu; Larsson, Andreas; Høivik, Nils Deneke; Aasmundtveit, Knut Eilif. (2010) Gold to gold thermosonic bonding Characterization of bonding parameters . Curran Associates, Inc.
  Academic chapter/article/Conference paper

2009

• Aasmundtveit, Knut E.; Wang, Kaiying; Høivik, Nils; Graff, Joachim M.; Elfving, Anders. (2009) Au-Sn SLID bonding: fluxless bonding with high temperature stability to above 350 °C.
  Academic chapter/article/Conference paper
• Duan, Ani; Wang, Kaiying; Aasmundtveit, Knut E.; Høivik, Nils. (2009) Characterization of wafer-level bonded hermetic packages using optical leak detection. SPIE - The International Society for Optics and Photonics
  Academic chapter/article/Conference paper
• Aasmundtveit, Knut E.; Payen, Sébastien; Pisano, Albert P.. (2009) Hydrogel-based Glucose Sensor for Grapes: In-vivo Measurements as the Grape Grows on the Vine.
  Chapter
• Johannessen, Rolf; Oldervoll, Frøydis; Kristiansen, Helge; Tyldum, Hallvard; Nguyen, Hoang Vu; Aasmundtveit, Knut E.. (2009) Investigation of Compliant Interconnect for Ball Grid Array (BGA).
  Academic chapter/article/Conference paper
• Johannessen, Rolf; Oldervoll, Frøydis; Kristiansen, Helge; Tyldum, Hallvard; Nguyen, Hoang-Vu; Aasmundtveit, Knut Eilif. (2009) Investigation of Compliant Interconnect for Ball Grid Array (BGA).
  Academic chapter/article/Conference paper
• Duan, Ani; Bin, Wu; Aasmundtveit, Knut E.; Imenes, Kristin; Høivik, Nils. (2009) Characterization of Screen Printed Glass Frit Seals for High Density Wafer Level Bonding.
  Chapter
• Nguyen, Hoang Vu; Oldervoll, Frøydis; Larsson, Andreas; Poppe, Erik; Johannessen, Rolf; Kristiansen, Helge. (2009) Effect of Pitch Factor on Reliability of Interconnects Using Anisotropic Conductive Films: An Initial Study.
  Chapter

2008

• Imenes, Kristin; Aasmundtveit, Knut E.; Bjørnsen, Geir; Moreno, Pablo; de Aldana, Javier R. Vázques. (2008) Micro ribbon cable bonding for an implantable device. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Wang, Kaiying; Aasmundtveit, Knut E.; Jakobsen, Henrik. (2008) Surface evolution and bonding properties of electroplated Au/Sn/Au. IEEE conference proceedings
  Academic chapter/article/Conference paper
• Nguyen, Hoang Vu; Johannessen, Rolf; Aasmundtveit, Knut E.; Høivik, Nils. (2008) High-reliability gold stud bump bonding for harsh environments. International Microelectronics and Packaging Society (IMAPS)
  Chapter
• Liu, He; Husa, Ellen Marie; Ramic, Zekija; Munding, Andreas; Aasmundtveit, Knut E.; Høivik, Nils. (2008) Uniformity requirements for electroplated Cu-Sn interconnects used in heterogeneous 3-D MEMS/ASIC stacks. International Microelectronics and Packaging Society (IMAPS)
  Chapter

2007

• Imenes, Kristin; Aasmundtveit, Knut E.; Husa, Ellen Marie; Høgetveit, Jan Olav; Halvorsen, Steinar; Elle, Ole Jakob. (2007) Packaging of an implantable accelerometer for measurements of heart motion. International Microelectronics and Packaging Society (IMAPS)
  Other
• Imenes, Kristin; Aasmundtveit, Knut E.; Husa, Ellen Marie; Høgetveit, Jan Olav; Halvorsen, Steinar; Elle, Ole Jakob. (2007) Assembly and packaging of a three-axis micro accelerometer used for detection of heart infarction. Biomedical microdevices
  Academic article
• Imenes, Kristin; Aasmundtveit, K; Husa, EM; Høgetveit, Jan Olav; Halvorsen, Steinar; Elle, Ole Jakob. (2007) Assembly and packaging of a three-axis micro accelerometer used for detection of heart infarction. Biomedical microdevices
  Academic article

2005

• Imenes, Kristin; Aasmundtveit, Knut E.; Hoff, Lars; Elle, Ole Jakob. (2005) Biocompatible packaging of a three-axis micro accelerometer.
  Academic chapter/article/Conference paper
• Aasmundtveit, Knut E.. (2005) Si-substrater preparert for SAM-behandling : en undersøkelse utført for Ignis Photonyx. Universitetet i Sørøst-Norge/Universitetet i Søraust-Noreg Universitetet i Sørøst-Norge/Universitetet i Søraust-Noreg
  Report
• Aasmundtveit, Knut E.. (2005) Electrical contact in silver epoxy : a study of optical modulators from Ignis Photonyx. Universitetet i Sørøst-Norge/Universitetet i Søraust-Noreg Universitetet i Sørøst-Norge/Universitetet i Søraust-Noreg
  Report
• Aasmundtveit, Knut E.. (2005) Organization and building of R & D laboratories for packaging of microsystems. Universitetet i Sørøst-Norge/Universitetet i Søraust-Noreg Universitetet i Sørøst-Norge/Universitetet i Søraust-Noreg
  Report

2004

• Samuelsen, Emil J; Aasmundtveit, Knut E.; Breiby, Dag Werner. (2004) Self-organisation within thin layers of polymeric semiconductors. Research Signpost
  Academic chapter/article/Conference paper

2001

• Samuelsen, Emil J; Monkman, A. P.; Pettersson, L. A. A.; Horsburgh, L. E.; Aasmundtveit, K. E.; Ferrer, S.. (2001) The structure of polypyridine. Synthetic metals
  Academic article

2000

• Aasmundtveit, K. E.; Samuelsen, Emil J; Inganas, O.; Pettersson, L. A. A.; Johansson, T.; Ferrer, S.. (2000) Structural aspects of electrochemical doping and dedoping of poly(3,4-ethylenedioxythiophene). Synthetic metals
  Academic article
• Aasmundtveit, K. E.; Samuelsen, Emil J; Hoffmann, K.; Bakken, Ellef; Carlsen, Per Henning. (2000) Structural studies of polyalkylthiophenes with alternating sidechain positioning. Synthetic metals
  Academic article
• Aasmundtveit, K. E.; Samuelsen, Emil J; Guldstein, M.; Steinsland, C.; Flornes, O.; Fagermo, C.. (2000) Structural anisotropy of poly(alkylthiophene) films. Macromolecules
  Academic article

1999

• Xie, Hongwei; Corish, J; Morton-Blake, D.A.; Aasmundtveit, Knut. (1999) An atomistic simulation of thermochromic distorsions in poly(3-butylthiophene). Radiation effects and defects in solids (Print)
  Academic article
• Aasmundtveit, Knut E.; Samuelsen, Emil J; Steinsland, Christian; Meneghini, Carlo; Filipponi, Adriano. (1999) EXAFS studies of iodine-doped poly(octylthiophene). Synthetic metals
  Academic article
• Aasmundtveit, Knut E.; Samuelsen, Emil J; Pettersson, Leif A.A.; Inganäs, Olle; Johansson, Tomas; Feidenhansl, Robert. (1999) Structure of thin films of poly(3,4-ethylenedioxythiophene). Synthetic metals
  Academic article
• Inganas, O.; Ghosh, S.; Samuelsen, Emil J; Aasmundtveit, Knut E.; Pettersson, L. A. A.; Johansson, T.. (1999) Model polymers for polymer actuators. Proceedings of SPIE, the International Society for Optical Engineering
  Academic article
• Aasmundtveit, Knut Eilif. (1999) Structure of various substituted polythiophenes, studied in bulk and as thin films. Norges Teknisk-Naturvitenskapelige Universitet
  Doctoral dissertation

1997

• Konestabo, Ove R.; Aasmundtveit, Knut E.; Samuelsen, Emil J; Bakken, Eivind; Carlsen, Per Henning. (1997) Role of sidechain sequence in stereoregular polyalkylterthiophene. Synthetic metals
  Academic article
• Aasmundtveit, K.E.; Samuelsen, Emil J; Mårdalen, J.; Bakken, Ellef; Carlsen, Per Henning. (1997) Orientation effect in thin layers of polythiophene on glass studied by synchroton X-ray diffraction. Synthetic metals
  Academic article
• Aasmundtveit, Knut E.; Samuelsen, Emil J; Mårdalen, Jostein; Bakken, Eivind; Carlsen, Per Henning; Lienert, U.. (1997) Orientation effect in thin layers of poly(octylthiophene) on glass studied by synchrotron X-ray diffraction. Synthetic metals
  Academic article

1995

• Aasmundtveit, Knut; Genoud, Francoise; Houzé, Emmanuel; Nechtschein, Maxime. (1995) Oxygen-induced ESR line broadening in conducting polymers. Synthetic metals
  Academic article