Physical - cleanroom - NanoLab
Cleanroom area for synthesis and structuring by physical methods
This area is equipped for thin film growth, micro- and nanolithographic methods and various etching processes. The area holds cleanroom class ISO6 (1000) to ISO 5 (100).
The area is equipped for the following types of activities:
- UV lithography
- Electronbeam lithography (EBL)
- Nanoimprinting Metal deposition by thermal evaporation and and sputtering
- Deposition of dielectrics, oxides, nitrides and magnetic material
- Wet etching
- Dry etching (CAIBE, ICP-RIE)
Specialized equipment:
- Maskaligners for photolithography and nanoimprinting
- EBL for high resolution electron beam lithography over large areas
- Plasma etchers for chlorine and fluorine based etching (ICP-RIE)
- PECVD (Plasma enhanced chemical vapour deposition)
- Thermal CVD (Chemical vapor deposition for graphene production)
- Equipment for HF-etching
- CAIBE (ion beam etcher) for etching any material
- Electron beam evaporators
- Sputter coater
Cleanroom information
- Access to NTNU NanoLab
- Equipment and processes
(NorFab web page) - Courses
- Current Prices (PDF)
- Support (NorFab web page)